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FPF1107 / FPF1108 -- Advance Load Management Switch
November 2009
FPF1107 / FPF1108 Advance Load Management Switch
Features
1.2V to 4V Input Voltage Operating Range Typical RDS(ON): - 35m at VIN=3.3V 55m at VIN=1.8V 85m at VIN=1.2V
Description
The FPF1107/08 are low RDS P-channel MOSFET load switches of the IntelliMAXTM family. Integrated slew-rate control prevents inrush current from glitch supply rails with capacitive loads common in power applications. The input voltage range operates from 1.2V to 4V to fulfill today's lowest ultra-portable device supply requirements. Switch control is by a logic input (ON-pin) capable of interfacing directly with low-voltage CMOS control signals and GPIOs in embedded processors.
Slew Rate Control with tR: 130s Output Discharge Function on FPF1108 Low <1A Quiescent Current at VON=VIN ESD Protected: Above 4000V HBM, 2000V CDM GPIO/CMOS-Compatible Enable Circuitry
Applications
Mobile Devices and Smart Phones Portable Media Devices Digital Cameras Advanced Notebook, UMPC, MID Portable Medical Devices GPS and Navigation Equipment
Ordering Information
Part Number
FPF1107 FPF1108
Switch Part Input Output ON Pin (Typical) Marking Buffer Discharge Activity At 1.8VIN
QC QD 55m 55m CMOS CMOS NA 65 Active HIGH Active HIGH
tR
130s 130s
Eco Status
Green Green
Package
4-Ball, Wafer-Level Chip-Scale Package (WLCSP), 1.0 x 1.0mm, 0.5mm Pitch
For Fairchild's definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
(c) 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 * Rev. 1.0.1
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FPF1107 / FPF1108 -- Advance Load Management Switch
Application Diagram
VIN CIN OFF ON ON
VOUT FPF1107/FPF1108 GND COUT
To Load
Figure 1. Typical Application Notes: 1. CIN=1F, X5R, 0603, for example Murata GRM185R60J105KE26 2. COUT=1F, X5R, 0805, for example Murata GRM216R61A105KA01
Block Diagram
FPF1107/8
Figure 2. Block Diagram (Output Discharge for FPF1108 Only)
(c) 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 * Rev. 1.0.1
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FPF1107 / FPF1108 -- Advance Load Management Switch
Pin Configurations
Figure 3. 1 x 1mm WLCSP Bumps Facing Down
Figure 4. 1 x 1mm WLCSP Bumps Facing Up
VOUT GND
A1
A2
VIN ON
VIN ON
A2
A1
VOUT GND
B2
B1
B1
B2
Figure 5. Pin Assignments (Top View)
Figure 6. Pin Assignments (Bottom View)
Pin Definitions
Pin #
A1 A2 B1 B2
Name
VOUT VIN GND ON
Description
Switch Output Supply Input: Input to the Power Switch. Ground ON/OFF Control, Active HIGH
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FPF1107 / FPF1108 -- Advance Load Management Switch
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.
Symbol
VIN ISW PD TSTG TA JA VIN, VOUT, VON to GND
Parameter
Maximum Continuous Switch Current Power Dissipation at TA=25C Storage Junction Temperature Operating Temperature Range Thermal Resistance, Junction-to-Ambient 1S2P with 1 Thermal Via 1S2P without Thermal Via Human Body Model, JESD22-A114 Charged Device Model, JESD22-C101
Min.
-0.3
Max.
4.2 1.2 1.0
Unit
V A W C C C/W
-65 -40
+150 +85 95 187
4 kV 2
ESD
Electrostatic Discharge Capability
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
VIN TA Supply Voltage
Parameter
Ambient Operating Temperature
Min.
1.2 -40
Max.
4.0 +85
Unit
V C
(c) 2009 Fairchild Semiconductor Corporation FPF1107 / FPF1108 * Rev. 1.0.1
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FPF1107 / FPF1108 -- Advance Load Management Switch
Electrical Characteristics
Unless otherwise noted, VIN=1.2 to 4.0V, TA=-40 to +85C, typical values are at VIN=3.3V and TA=25C.
Symbol
Basic Operation VIN IQ(OFF) ISD(OFF) IQ
Parameter
Supply Voltage Off Supply Current Off Switch Current Quiescent Current
Conditions
Min.
1.2
Typ.
Max.
4.0 1 1 1 3
Units
V A A A
VON=GND VOUT=Open, VIN=4V VON=GND VOUT=GND IOUT=0mA, VON=VIN IOUT=0mA, VON < VIN VIN=3.3V, IOUT=200mA, TA=25C VIN=1.8V, IOUT=200mA, TA=25C 35 55 70 85 65 65 1.1
50 70 m 150 100 110 V 0.35 V A s s s 95 120 215 2.5 s s s s s s s s s 2.5 s s s s s s 1
RON
On Resistance
VIN=1.5V, IOUT=200mA, TA=25C VIN=1.2V, IOUT=200mA, TA=25C VIN=1.8V, IOUT=200mA, TA=85C
(3)
RPD VIH VIL ION tDON tR tON tDON tR tON FPF1107 tDOFF tF tOFF tDOFF tF tOFF FPF1108 tDOFF tF tOFF tDOFF tF tOFF
(5)
Output Discharge RPULL DOWN On Input Logic High Voltage On Input Logic Low Voltage On Input Leakage Turn-On Delay Turn-On Time
(4) (4)
VIN=3.3V, VON=0V, IFORCE=20mA, TA=25C, FPF1108 VIN=1.2V to 4.0V VIN=1.2V to 4.0V VON=VIN or GND -1
Dynamic Characteristics VOUT Rise Time Turn-On Delay Turn-On Time VIN=3.3V, RL=10, CL=0.1F, TA=25C, FPF1107/8 80 130 210 70 95 165 2.0 2.2 4.2 7.0 110 117 2.0 1.9 3.9 2.5 10.6 13.1
(4,6) (4) (4)
VOUT Rise Time
(4,6)
VIN=3.3V, RL=500, CL=0.1F, TA=25C, FPF1107/8
Turn-Off Delay VOUT Fall Time Turn-Off
(4,7)
(4)
(4)
VIN=3.3V, RL=10, CL=0.1F, TA=25C
Turn-Off Delay VOUT Fall Time Turn-Off
(4,7)
(4)
(4)
VIN=3.3V, RL=500, CL=0.1F, TA=25C
Turn-Off Delay VOUT Fall Time Turn-Off
(4,7)
(4)
(4)
VIN=3.3V, RL=10, CL=0.1F, RPD=65, TA=25C
Turn-Off Delay VOUT Fall Time Turn-Off
(4,7)
(4)
(4)
VIN=3.3V, RL=500, CL=0.1F, RPD=65, TA=25C
Notes: 3. This parameter is guaranteed by design and characterization; not production tested. 4. tDON/tDOFF/tR/tF are defined in Figure 7. 5. Output discharge path is enabled during off.
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FPF1107 / FPF1108 -- Advance Load Management Switch
Timing Diagram
90% VOUT 10% tR
90% 10% tF
3.3V 50% VON 50%
90% VOUT tDON 10% tDOFF
Notes: 6. tON=tR + tDON. 7. tOFF=tF + tDOFF.
Figure 7. Timing Diagram
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FPF1107 / FPF1108 -- Advance Load Management Switch
Typical Performance Characteristics
0.30 0.25 0.20 VIN = 4.0V 0.15 VIN = 3.3V 0.10 VIN = 1.2V 0.05 0.00 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C)
V IN SH UTDOW N C U R RENT ( A)
0 .2 5
VON = VOUT = 0V V IN SH U T DO W N C U R R EN T ( A )
VON = V OUT = 0V 0 .2 0
0 .1 5
0 .1 0 8 5 C 0 .0 5 2 5 C 0 .0 0 1 .0 1 .5 2 .0 2 .5 3 .0 3 .5 4 .0 S U PP L Y V O L T A G E (V ) -4 0 C
Figure 8. Shutdown Current vs. Temperature
Figure 9. Shutdown Current vs. Supply Voltage
0.10 0.09 O FF SU PPLY CUR RENT ( A) 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C) VIN = 3.3V VIN = 1.2V VIN = 4.0V VON = 0V O FF SUPPLY CU RRENT ( A)
0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 1.0 1.5 2.0 2.5 3.0 3.5 4.0 SUPPLY VOLTAGE (V) -40C 25C VON = 0V
85C
Figure 10. Off Supply Current vs. Temperature (FPF1107, VOUT is Floating)
0.050 0.045 SUPPLY CU RRENT ( A) 0.040 0.035 0.030 0.025 0.020 0.015 0.010 0.005 0.000 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C) VIN = 3.3V VIN = 1.2V VIN = 4.0V VON = VIN
Figure 11. Off Supply Current vs. Supply Voltage (FPF1107, VOUT is Floating)
0.40 0.35 SUPPLY CURRENT ( A) 0.30 0.25 0.20 0.15 0.10 25C 0.05 0.00 1.0 1.5 2.0 2.5 3.0 3.5 4.0 SUPPLY VOLTAGE (V) 85C -40C VON = VIN
Figure 12. Quiescent Current vs. Temperature (VON=VIN)
Figure 13. Quiescent Current vs. Supply Voltage
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FPF1107 / FPF1108 -- Advance Load Management Switch
Typical Performance Characteristics
3.00 VON = 0.75 x VIN 2.50 S U PP L Y C U R RE N T ( A ) 2.00 1.50 VIN = 3.3V 1.00 0.50 VIN = 1.2V 0.00 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C)
0.00 1.0 1.5 2.0 2.5 3.0 S U P P LY V O LTA G E (V ) 3.5 4.0
S U P P LY C U R R E N T (A)
2.50
VIN = 4.0V
2.00
+25C
1.50 +85C 1.00 -40C 0.50
Figure 14. Quiescent Current vs. Temperature (VON=0.75 x VIN)
120 100 O N R E SIS TA N C E (m ) 80 60 VIN = 3.3V 40 20 0 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C) VIN = 4.0V VIN = 1.2V VON = VIN IOUT = 200mA
)
Figure 15. Quiescent Current vs. Supply Voltage at VON=1.2V
300 250 200 150 100 85C 50 0 1.0 1.5 2.0 -40C 2.5 3.0 3.5 4.0 25C VON=VIN IOUT=200mA
ON RESI STANCE (m
SUPPLY VOLTAGE (V)
Figure 16. RON vs. Temperature
1.00
V ON INPUT LO GIC VO L TAGE (V)
Figure 17. RON vs. Supply Voltage
0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 1.0
25C
V IH
V IL
1.5
2.0
2.5
3.0
3.5
4.0
SUPPLY VOL TAGE (V)
Figure 18. ON-Pin Threshold vs. VIN
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FPF1107 / FPF1108 -- Advance Load Management Switch
Typical Performance Characteristics
100 0 V IN = 3.3V C L = 0.1 F R L = 10
1000
RIS E/FA L L TIM E ( s)
t 10 0
R
O N /O F F D ELAY T IM E ( s)
V IN = 3.3V C L = 0.1F R L = 10 tDON
100
10 t 1 -40 -15 10 35 60 85 T J , JUN C T IO N T EM PERA T UR E (C )
F
10 tDOFF 1 -40 -15 10 35 60 85 T J , JUNCTION TEMP ERATURE (C)
Figure 19. VOUT Rise and Fall Time vs. Temperature at RL=10
120 110
R IS E/FA L L TIM E ( s)
Figure 20. VOUT Turn-On and Turn-Off Delay vs. Temperature at RL=10
100 V IN = 3.3V C L = 0.1F R L = 500
100 90 80 70 60 50 -40 -15 10
t
ON/OF F DELAY TIME ( s)
F
V IN = 3.3V C L = 0.1F R L = 500
90 80 70 60 50 40 30 20 10 0 tDOFF tDON
tR
35
60
85
-40
-15
10
35
60
85
T J , JU N CTION TEMP ER ATU RE (C)
T J , JU N CTION TEMPER ATU RE (C)
Figure 21. VOUT Rise and Fall Time vs. Temperature at RL=500
1 60 1 40 1 20
Figure 22. VOUT Turn-On and Turn-Off Delay vs. Temperature at RL=500
R ISE / D ELAY T IM E [s]
tR
1 00 80 60 40 20
t DON
10
1 00
10 00
O U T PU T LO AD [
]
Figure 23. VOUT Turn-On and Turn-Off Delay vs. Output Load at VIN=3.3V
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FPF1107 / FPF1108 -- Advance Load Management Switch
Typical Performance Characteristics
Figure 24. Turn-On Response (VIN=3.3V, CIN=1F, COUT=0.1F, RL=10)
Figure 25. Turn-Off Response (VIN=3.3V, CIN=1F, COUT=0.1F, RL=10)
Figure 26. Turn-On Response (VIN=3.3V, CIN=1F, COUT=0.1F, RL=500)
Figure 27. Turn-Off Response (FPF1107 - No Output Pull-Down Resistor) (VIN=3.3V, CIN=1F, COUT=0.1F, RL=500)
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FPF1107 / FPF1108 -- Advance Load Management Switch
Application Information
Input Capacitor
The IntelliMAX switch doesn't require input capacitor. To reduce device inrush current effect, a 0.1F ceramic capacitor, CIN, is recommended close to the VIN pin. A higher value of CIN can be used to further reduce the voltage drop experienced as the switch is turned on into a large capacitive load.
TM
Fall Time
Device output fall time can be calculated based on RC constant of external components as follows:
tF = RL x CL x 2.2
(1)
Output Capacitor
The IntelliMAX switch works without an output capacitor. However, if parasitic board inductance forces VOUT below GND when switching off, a 0.1F capacitor, COUT, should be placed between VOUT and GND.
TM
where tF is 90% to 10% fall time, RL is output load and CL is output capacitor. The same equation works for a device with a pull-down output resistor, then RL is replaced by a parallel connected pull-down and external output resistor combination, as follows:
tF = R L x R PD x C L x 2. 2 R L + R PD
(2)
where tF is 90% to 10% fall time, RL is output load, RPD=65 is output pull-down resistor, and CL is the output capacitor.
Resistive Output Load
If resistive output load is missing, the IntelliMAX switch without pull-down output resistor is not discharging output voltage. Output voltage drop depends, in that case, mainly on external device leaks.
TM
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FPF1107 / FPF1108 -- Advance Load Management Switch
Recommended Land Pattern and Layout
For best thermal performance and minimal inductance and parasitic effects, it is recommended to keep input and output traces short and capacitors as close to the device as possible. Below is a recommended layout for this device to achieve optimum performance.
Figure 28. Recommended Land Pattern and Layout
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FPF1107 / FPF1108 -- Advance Load Management Switch
Physical Dimensions
0.03 C 2X
E
A B
F 0.50 (O0.250) Cu Pad
PIN A1 AREA
D 0.03 C 2X
0.50 (O0.350) Solder Mask
TOP VIEW
RECOMMENDED LAND PATTERN (NSMD PAD TYPE)
0.06 C 0.3320.018 0.2500.025
0.05 C
0.625 0.539
C D
SEATING PLANE
SIDE VIEWS
0.005
O0.3150.025 4X
0.50
CAB
NOTES:
A. NO JEDEC REGISTRATION APPLIES. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS 43 MICRONS (539-625 MICRONS). F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. G. DRAWING FILENAME: MKT-UC004ABrev2.
0.50
B A 12
(Y)0.018 F
(X)0.018
BOTTOM VIEW
Figure 29. 4 Ball, 1.0 x 1.0mm Wafer Level Chip Scale WLCSP Packaging
Product-Specific Dimensions
Product
FPF1107 FPF1108
D
960m 30m 960um 30m
E
960m 30m 960um 30m
X
0.230mm 0.230mm
Y
0.230mm 0.230mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor's online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/.
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FPF1107 / FPF1108 -- Advance Load Management Switch
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